5 years as independent consultant to more than a dozen clients in the microelectronics and medical device industries.
Selected Recent Publications/Presentations -- Author or co-author of the following:
“Hydrophobicity”, Minnowbrook Microelectronics Conference, 2006.
“Tin -- Back to the Future”, Minnowbrook Microelectronics Conference, 2005.
“Critical Surface Properties by Microdroplet Contact Angle”, Minnowbrook Microelectronics Conference, 2004.
“Analysis of Volatile Gases in Hermetic MEMS Enclosures”, ISTFA Desk Reference Supplement, 2002.
“Reducing Top-of-Die Plastic Delamination by Assuring Pre-Mold Cleanliness of Die Surfaces”, Proc. ISTFA, 2000.
“Sources and Control of Gases Hazardous to Hermetic Electronic Enclosures”, IEEE Trans. Elect. Pack. Mfg., 1999.
“Evaluation of the Resistance of Individual Silicon Die to Cracking”, Proc. ISTFA, 1998.
“Identifying Plastic Encapsulant Materials by Pyrolysis IR Spectrophotometry”, Proc. ISTFA, 1998.
Patents -- Inventor or co-inventor of the following:
Measuring moisture content of hermetic semiconductor devices, 4,272,986
Enhancing silicon etching of alkali hydroxide by addition of positive valence impurity ions, 4,781,853; 4,859,280
Bonded wafer processing, 5,362,667; 5,517,047; 5,728,624
Bonded wafer processing with metal silicidation, 5,387,555; 5,569,620; 6,909,146
Radiation hardened dielectric for EEPROM, 5,808,353; 6,130,172
Bonded wafer processing with oxidative bonding, 5,849,627
Decapsulating method and apparatus for integrated circuit packages, 6,054,012; 6,457,506
Laser decapsulation method, 6,335,208
Method for minimizing moisture adsorption on printed circuit boards -- Pending
Method for gettering solvent vapors from sealed microelectronic enclosures -- Pending
